Publisher: Administrator Date：2023-09-08
MRSI (Mycrinic Group) has released a high-force die bonder, offering a new solution specifically designed for power devices and advanced chip packaging.
Press Releases
MRSI (Mycronic Group), a global leader in the manufacture of fully automatic, high-speed, high-precision, and flexible multifunctional mounting systems, is pleased to announce the launch of the MRSI-705HF high-force die bonder, a new version of the proven MRSI-705 platform.
The MRSI-705HF is equipped with a heated bonding head that can apply a force of up to 500N during the bonding process while providing 400°C of heating from the top. It is an ideal tool for advanced packaging applications, such as sintering of power semiconductors and thermo-compression bonding for IC packaging. Sintering is a thermal process that provides higher strength, integrity, and conductivity for chip bonding and is considered the most reliable technology for power electronic component bonding. Thermo-compression bonding is a technique that uses high temperature and pressure to establish a robust and reliable interconnection between the chip and the substrate. The MRSI-705HF inherits the flexibility and stability of the MRSI-705 platform, capable of handling multi-chip and multi-process applications in one machine, including automatic nozzle change and laser welding, top and bottom heating co-firing, epoxy dispensing, and drop dispensing.
Dr. Irving Wang, Director of Marketing at MRSI Systems, said: "We are proud to announce that the new MRSI-705HF high-force die bonder is part of our ongoing innovation and commitment to helping our customers meet the evolving market demands. It will enable us to better serve our customers in the power device and advanced chip packaging industries."
About Mycronic Automation (Shenzhen) Co., Ltd.
Mycronic AB is a Swedish high-tech company listed on the Nasdaq Stockholm, specializing in the development, manufacturing, and sales of production equipment that meets the high-precision and flexibility requirements of the electronics industry. MRSI SYSTEMS, under the Mycronic Group, is a global leader in the manufacture of fully automatic, high-speed, high-precision, and flexible multifunctional mounting systems, providing the most effective systems and assembly solutions for all levels of packaging. Mycronic Automation (Shenzhen) Co., Ltd. is a wholly-owned subsidiary of Swedish Mycronic AB, registered in China. It is a strategic move for the localization of MRSI SYSTEMS' business in China, co-located with the MRSI Shenzhen Product Demonstration Center and operates under the MRSI brand. In addition to continuing MRSI's business in China, Mycronic Automation will also engage in localized application product development, offering customers more packaging application solutions and higher quality services.
