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Semiconductor/Advanced Packaging/Micro Assembly
Optical Communication & Photo-communication/IGBT
Kurtz Ersa / 库尔特埃莎
先进半导体芯片及系统级封装贴片机FUZIONSC l器件:008004~150*150 mm l基板:813*610mm l贴装精度:<10um l贴装重复精度:<3um l超低贴装压力:30g Multi-Die Flip Chip & SiP 多芯片、倒装芯片及系统级封装……
Keysight
金线电气结构测试设备
SPEA
先进半导体芯片及系统级封装贴片机FUZIONSC l器件:008004~150*150 mm l基板:813*610mm l贴装精度:<10um l贴装重复精度:<3um l超低贴装压力:30g Multi-Die Flip Chip & SiP 多芯片、倒装芯片及系统级封装……
MRSI
先进半导体芯片及系统级封装贴片机FUZIONSC l器件:008004~150*150 mm l基板:813*610mm l贴装精度:<10um l贴装重复精度:<3um l超低贴装压力:30g Multi-Die Flip Chip & SiP 多芯片、倒装芯片及系统级封装……
CAPCON
先进封装贴片/固晶机
Pac Tech
先进半导体芯片及系统级封装贴片机FUZIONSC l器件:008004~150*150 mm l基板:813*610mm l贴装精度:<10um l贴装重复精度:<3um l超低贴装压力:30g Multi-Die Flip Chip & SiP 多芯片、倒装芯片及系统级封装……
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